John Osenbach is a distinguished engineer in the optical module advanced development team in Infinera. He has been with Infinera for 4 yrs. Prior to Infinera, after receiving his PhD in ceramic science and engineering from Penn State, he joined AT&T and remained in AT&T and its semiconductor offshoot companies; Lucent, Agere, and LSI, for 30+ years. He is a Bell labs fellow and an LSI fellow. His primary interests are in the development, integration and application of materials, processing and architectures thereof to enable leading edge-,cost effective-, reliable- semiconductor devices, packages, and systems. He is author or co-author of 85 US patents, over 120 papers and talks on topics ranging from 600-1000Gbaud photonic modules, to diffusion in semiconductor passivation materials, reliable non-hermetic lasers and photo diodes, Sn whiskers, structure and stability of RoHS compliant solder joints, Cu-pillar flip chip devices, and fan out level packaging. He is a past associate editor of the Journal of Electrochemical Society, has organized and chaired numerous session on dielectrics, metals, packaging, and reliability of semiconductor devices and packages for multiple professional societies including ECS, TMS, and IEEE-CMPT.