Yanfeng Lao is a Senior Optical Engineer at Hisense Photonics Inc with many years’ experience in optoelectronic material and device researches, specialized in semiconductor lasers and photodetectors. He received Ph.D. degree in microelectronics and solid-state electronics from Shanghai Institute of Microsystem and Information Technology, CAS, China, where he has focused on developing 1310-nm Vertical-Cavity Surface-Emitting Lasers. He was a researcher with the Department of Physics and Astronomy, Georgia State University working on III-V material research and photodetector development. At Hisense Photonics, he has been involved with developing R&D laser projects including new product design and process development, as well as transitioning the project from R&D phase into mass production. His specialties include III-V epitaxy (MBE), design of device structure and process flow, and material & device characterizations.
Hisense Photonics Inc. is a high-tech chip design and manufacturing company in South Plainfield, New Jersey. We offer a full portfolio of uncooled 1310 nm and 1550 nm laser products utilizing in-house FP, DFB, EML, Tunable DBR, Tunable EML chips, etc., reaching speeds up to 25/56 Gps. We have fully integrated manufacturing model that enhances product reliability, manufacturability and performance, and control all phases of the development and manufacturing process in-house, spanning from device design & simulation to MOCVD epitaxy, full III-V wafer processing lines, and highly automated packaging techniques and a robust final testing platform.
Hisense Photonics manufactures key innovative in-house technologies, which ensure our position as an optoelectronics industry leader. Our proven modular technology platforms, supported by a library of patents, ensure that each of our products have been designed to provide the most advance and competitive optical solutions for today’s Fiber-To-the-Home (FTTH), Cable Television, Data Communications Network and Consumer Electronics markets. Our technical mandate is to simplify our customer’s increasingly complex optical communications challenges through functional and monolithic integration.